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In the silver plating of copper, K[Ag(CN)2] is used instead of AgNO3. The reason is

1. A thin layer of Ag is formed on Cu
2. More voltage is required
3. Ag+ ions are completely removed from solution
4. Less availability of Ag+ ions, as Cu cannot displace Ag from [Ag(CN)2]- ion

Correct answer: Less availability of Ag+ ions, as Cu cannot displace Ag from [Ag(CN)2]- ion

Solution

K[Ag(CN)2] is used because the [Ag(CN)2]- complex reduces the availability of free Ag+ ions, preventing copper from directly displacing silver. This ensures controlled deposition of silver during plating.

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